Group 1: Medical Ultrasonics
Group Chair: Hervé Liebgott, University of Lyon
Group Co-Chair: Helen Mulvana, University of Strathclyde
Mike Averkiou, University of Washington
Kenneth Bader, University of Chicago
Adrian Basarab, University of Lyon
Carolyn Bayer, Tulane University
Muyinatu Bell, Johns Hokins University
Mark Borden, University of Colorado Boulder
Ayache Bouakaz, INSERM
Lori Bridal, CNRS at Sorbonne University
Matthew Bruce, University of Washington
Elisabeth Brusseau, CNRS
Ewen Carcreff, TPAC
Stefan Catheline, INSERM, LabTAU
Shigao Chen, Mayo Clinic
Hong Chen, Washington University in St. Louis
Parag Chitnis, George Mason University
Magnus Cinthio, Lund University
Guy Cloutier, University of Montreal
Olivier Couture, CNRS at Sorbonne University
Yaoyao Cui, SIBET at Chinese Academy of Sciences
Jeremy Dahl, Stanford University
Paul Dayton, University of North Carolina/NCSU
Nico de Jong, Erasmus Medical Centre
Chris de Korte, Radboud University Medical Center
Libertario Demi, University of Trento
Cheri Deng, University of Michigan
Jan D'hooge, Catholic University of Leuven
Marvin Doyley, University of Rochester
Emad Ebbini, University of Minnesota
Yonina Eldar, Weizmann Institute of Science
Stanislav Emelianov, Georgia Institute of Technology and Emory University School of Medicine
Mostafa Fatemi, Mayo Clinic
Brian Fowlkes, University of Michigan
Steven Freear, University of Leeds
Caterina Gallippi, University of North Carolina
Fei Gao, ShanghaiTech University
Damien Garcia, INSERM
Aiguo Han, Virginia Tech University
Hideyuki Hasegawa, University of Toyama
Peter Hoskins, University of Edinburgh
Chih-Chung Huang, National Cheng Kung University
Safeer Hyder, Sukkur IBA University
Tali Ilovitsh, Tel-Aviv University
Kazuyo Ito, Tokyo University of Agriculture and Technology
Jørgen Jensen, Technical University Denmark
George Kapodistrias, Samsung Research America
Jeff Ketterling, Weill Cornell Medicine
Kang Kim, University of Pittsburgh
Michael Kolios, Ryerson University
Elisa Konofagou, Columbia University
Klazina Kooiman, Thoraxcenter, Erasmus MC
Denis Kouamé, U Paul Sabatier Toulouse
Nobuki Kudo, Hokkaido University
Arun Kumar Thittai, Indian Institute of Technology Madras
Cyril Lafon, INSERM, LabTAU
Roberto Lavarello, Pontificia Universidad Católica del Perú
Wei-Ning Lee, University of Hong Kong
Pai-Chi Li, National Taiwan University
Tong Li, United Imaging Ultrasound
Meng-Lin Li, National Tsing Hua University
Richard Lopata, Eindhoven University of Technology
Thanasis Loupas, Philips Ultrasound
Lasse Lovstakken, Norwegian University of Science and Technology
Jian-yu Lu, University of Toledo
Geoff Luke, Dartmouth College
Jianwen Luo, Tsinghua University
João Machado, University of Rio de Janeiro
Jonathan Mamou, Weill Cornell Medicine
Giulia Matrone, University of Pavia
Mami Matsukawa, Doshisha University
Bob McGough, Michigan State U.
Mohammad Mehrmohammadi, University of Rochester
Karla Mercado-Shekhar, Indian Institute of Technology Gandhinagar
Martin Mienkina, GE Healthcare
Massimo Mischi, Einhoven University of Technology
Larry Mo, Independent Consultant
Marie Muller, North Carolina State University
Kibo Nam, Thomas Jefferson University
Svetoslav Nikolov, BK Ultrasound
Michael Oelze, University of Illinois
Meaghan O'Reilly, Sunnybrook Research Institute
Virginie Papadopoulou, University of North Caroline at Chapel Hill
Theo Pavan, University of Sao Paulo
Mathieu Pernot, ESPCI Paris
Gianmarco Pinton, U. North Carolina
Jean Provost, École Polytechnique de Montréal
Alessandro Ramalli, University of Florence
Daniel Rohrbach, Verasonics
Yoshifumi Saijo, Tohoku University
Georg Schmitz, Ruhr-Universität Bochum
Ralf Seip, SonaCare Medical, LLC
Himanshu Shekhar, Indian Institute of Technology Gandhinagar
Pengfei Song, U. Illinois
Dean Ta, Fudan University
Mengxing Tang, Imperial College London
Mickael Tanter, INSERM
Juan Tu, Nanjing University
Matthew Urban, Mayo Clinic
Ton van der Steen, Erasmus Medical Centre
Tomy Varghese, U. Wisconsin
Francois Vignon, Butterfly Network
Mingxi Wan, Xi’an Jiaotong University
Xueding Wang, University of Michigan
Kendall Waters, Siemens Healthineers
Keith Wear, Food and Drug Administration
Wilko Wilkening, Siemens Healthineers
James Wiskin, QT Ultrasound Inc.
Tao Wu, ShanghaiTech University
Zhen Xu, University of Michigan
Tadashi Yamaguchi, Chiba University
Chih-Kuang Yeh, National Tsing Hua University
Shin Yoshizawa, Tohoku University
Alfred Yu, University of Waterloo
Roger Zemp, University of Alberta
Bajram Zeqiri, National Physical Laboratory
Xiaoming Zhang, Mayo Clinic
Yue Zhao, Harbin Institute of Technology
Hairong Zheng, Shenzhen Institutes of Advanced Technology
Yujin Zong, Xi'an Jiaotong University
Group 2: Sensors, NDE & Industrial Applications
Group Chair: Kui Yao, A*STAR, Singapore
Group Co-Chair: Erdal Oruklu, Illinois Institute of Technology
Walter Arnold, Fraunhofer Institute for NDT
Oluwaseyi Balogun, Northwestern Univ.
Lorenzo Capineri, U. Florence
James Friend, UCSD
Anthony Gachagan, University of Strathclyde, Glasgow
Edward Haeggstrom, University of Helsinki
Joel Harley, University of Florida
Jacqueline Hines, Applied Sensor R&D Corporation
Patrick Johnston, NASA Langley Research Center
Lawrence W. Kessler, Sonoscan Inc.
Makiko Kobayashi, Kumamoto University
Mario Kupnik, Technische Universität Darmstadt
Yufeng Lu, Bradley University
Roman Maev, University of Windsor
Donald McCann, Seadrill
Kentaro Nakamura, Tokyo Institute of Technology
Nishal Ramadas, Hy-Met Limited, UK
Jing Rao, Beihang University
Jafar Saniie, Illinois Institute of Technology
Bernhard Tittmann, Pennsylvania State University
John F. Vetelino, University of Maine
Paul Wilcox, University of Bristol
William Wright, University College Cork
Kailiang Xu, Fudan University, Shangai
Donald E. Yuhas, Industrial Measurement Systems
Group 3: Physical Acoustics
Group Chair: Yook-Kong Yong, Rutgers University
Group Co-Chair: Dave Feld, Skyworks, Inc.
Badreddine Assouar, University of Lorraine
Bernard Collet, Institut Jean le Rond d’Alembert – Sorbonne University, Paris France
Charles Courtney, Department of Mechanical Engineering, University of Bath
Itziar Gonzalez, National Research Council of Spain CSIC
Jae Youn Hwang, Daegu Gyeongbuk Institute of Science & Technology
Brice Ivira, R & D, Wireless Semiconductor Division, Avago Technologies, a Broadcom Ltd. Company, 1730 Fox Drive, San Jose, CA 95131
Noe Jimenez, Universitat Politecnica de Valencia
Yun Jing, Pennsylvannia State University
Takefumi Kanda, Graduate School of Natural Science and Technology, Okayama University, Okayama
Piotr Kiełczyński, Department of Theory of Continuous Media and Nanostructures, Institute of Fundamental Technological Research,
Eun Sok Kim, Department of Electrical Engineering, University of Southern California
Hung Ham Kim, Pohang University of Science and Technology
Kimmo Kokkonen, Qualcomm
Minoru Kuribayashi Kurosawa, School of Engineering, Tokyo Institute of Technology
Amit Lal, SonicMEMS Laboratory, Electrical and Computer Engineering, Cornell University
John Larson, R & D, Wireless Semiconductor Division, Avago Technologies, a Broadcom Ltd. Company, 1730 Fox Drive, San Jose, CA 95131
Vincent Laude, Institut FEMTO-ST, CNRS and Univ. Bourgogne Franche-Comté
Teng Ma, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, China
Andreas Mayer, Faculty B+W, HS Offenburg - University of Applied Sciences, Gengenbach
Alex Maznev, Department of Chemistry, Massachusetts Institute of Technology
Mihir Patel, MACOM
Mahesh Raveendranatha Panicker, Indian Institute of Technology Palakkad
Masaya Takasaki, Department of Mechanical Engineering, Saitama University
Koen W.A. van Dongen, Department of Imaging Physics; Delft University of Technology; Delft
István A. Veres, Qorvo Inc.
Jörg Wallaschek, Institute of Dynamics and Vibration Research, Leibniz Universität Hannover
Ji Wang, School of Mechanical Engineering & Mechanics, Ningbo University
Takahiko Yanagitani, Department of Electrical Engineering and Bioscience Waseda University
Lei Zhang, Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR)
Group 4: Microacoustics – SAW, FBAR & MEMS
Group Chair: Amelie Hagelauer, Technical University of Munich
Group Co-Chair: Shuji Tanaka, Tohoku University
Ben Abbott, Skyworks Solutions, Inc.
Kochhar Abhay, Akoustis Technologies, Inc.
Robert Aigner, Qorvo, Inc.
Reinhardt Alexandre, CEA-LETI
Ausrine Bartasyte, University of Franche-Comté
Sunil Bhave, Purdue University
Paul Bradley, Broadcom Ltd.
Marta Clement, Polytechnic University of Madrid (UPM)
Omar Elmazria, Université de Lorraine
Songbin Gong, University of Illinois at Urbana Champaign
Tao Han, Shanghai Jiao Tong University
Ken-ya Hashimoto, Chiba University
Shogo Inoue, Qorvo, Inc.
Michio Kadota, Tohoku University
Jyrki Kaitila,
Jan Kuypers, MEMS2market
Ryo Nakagawa, Murata Manufacturing Co., Ltd.
Hiroyuki Nakamura, Maxscend Technology JAPAN Corporation
Natalya Naumenko, National University of Science and Technology "MISIS"
Tuomas Pensala, VTT Technical Research Centre of Finland
Mauricio Pereira da Cunha, University of Maine
Maximilian Pitschi, Qualcomm / RF360 Europe GmbH
Matteo Rinaldi, Northeastern University
Rich Ruby, Broadcom Ltd.
Lu Ruochen, University of Texas Austin
Hagen Schmidt, Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden)
Marc Solal, Qorvo, Inc.
Masanori Ueda, TAIYO YUDEN CO., LTD.
Chauhan Vikrant, Qualcomm
Karl Wagner, Qualcomm / RF360 Europe GmbH
Ventsislav Yantchev, Chalmers University of Technology
Sergei Zhgoon, National Research University "MPEI" (Moscow Power Engineering Institute)
Group 5: Transducers & Transducer Materials
Group Chair: Alessandro Stuart Savoia, Roma Tre University
Group Co-Chair: Omer Oralkan, NC State University
Enrico Boni, University of Florence
Jeremy Brown, Dalhousie University
Dominique Certon, Francois Rabelais University of Tours
David Cowell, University of Leeds
Loriann Davidsen, Philips Healthcare
Levent Degertekin, Georgia Institute of Technology
Christine Démoré, University of Toronto
Charles Emery, Merz North America
Arif Sanli Ergun, Orchard Ultrasound Innovation, LLC
Nicolas Felix, Vermon SA
Vittorio Ferrari, University of Brescia
Tomas Gomez, CSIC, Madrid
Anne-Christine Hladky, Institut Supérieur d'Electronique et du Numerique
Xiaoning Jiang, NC State University
Valsala Kurusingal, Thales Australia
Koko Lam, The Hong Kong Polytechnic University
Ho-Yong Lee, Ceracomp Co., Ltd
Franck Levassort, Francois Rabelais University of Tours
Xiang Li, Acoustic Life Science Co., Ltd.
Brooks Lindsey, Georgia Institute of Technology
Jessica Liu Strohmann, Qualcomm Inc.
Yipeng Lu, Peking University
Jianguo Ma, Beihang University
Richard O'Leary, University of Strathclyde
Michiel Pertijs, Delft University of Technology
Weibao Qiu, Shenzhen Institutes of Advanced Technology
Wei Ren, Xi'an Jiaotong University
Yongrae Roh, Kyungpook National University
Stefan Rupitsch, Friedrich-Alexander University
Susan Trolier-McKinstry, Pennsylvania State University
Jian Yuan, ALS Shanghai
Shujun Zhang, University of Wollongong
Qifa Zhou, University of Southern California